A self-powered implantable and bioresorbable electrostimulation device for biofeedback bone fracture healing.

Jul 19, 2021

Contributor: Guang Yao,Lei Kang,Cuicui Li,Sihong Chen,Qian Wang,Junzhe Yang,Yin Long,Jun Li,Kangning Zhao,Weina Xu,Weibo Cai,Yuan Lin,Xudong Wang

$A self-powered implantable and bioresorbable electrostimulation device for biofeedback bone fracture healing.$

Electrostimulation has been recognized as a promising nonpharmacological treatment in orthopedics to promote bone fracture healing. However, clinical applications have been largely limited by the complexity of equipment operation and stimulation implementation. Here, we present a self-powered implantable and bioresorbable bone fracture electrostimulation device, which consists of a triboelectric nanogenerator for electricity generation and a pair of dressing electrodes for applying electrostimulations directly toward the fracture. The device can be attached to irregular tissue surfaces and provide biphasic electric pulses in response to nearby body movements. We demonstrated the operation of this device on rats and achieved effective bone fracture healing in as short as 6 wk versus the controls for more than 10 wk to reach the same healing result. The optimized electrical field could activate relevant growth factors to regulate bone microenvironment for promoting bone formation and bone remodeling to accelerate bone regeneration and maturation, with statistically significant 27% and 83% improvement over the control groups in mineral density and flexural strength, respectively. This work provided an effective implantable fracture therapy device that is self-responsive, battery free, and requires no surgical removal after fulfilling the biomedical intervention.
Copyright © 2021 the Author(s). Published by PNAS.

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About The Expert

Guang Yao

Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI 53706; xudong.wang@wisc.edu gyao@uestc.edu.cn linyuan@uestc.edu.cn wcai@uwhealth.org.

School of Materials and Energy, State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan 610054, China.

School of Electronic Science and Engineering, the Center for Information in Medicine, University of Electronic Science and Technology of China, Chengdu, Sichuan 611731, China.

Lei Kang

Department of Nuclear Medicine, Peking University First Hospital, Beijing 100034, China.

Department of Radiology and Medical Physics, University of Wisconsin-Madison, Madison, WI 53705.

Cuicui Li

Department of Nuclear Medicine, Peking University First Hospital, Beijing 100034, China.

Sihong Chen

School of Materials and Energy, State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan 610054, China.

Qian Wang

School of Materials and Energy, State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan 610054, China.

Junzhe Yang

Department of Nuclear Medicine, Peking University First Hospital, Beijing 100034, China.

Yin Long

Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI 53706.

School of Materials and Energy, State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan 610054, China.

Jun Li

Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI 53706.

Kangning Zhao

Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI 53706.

Weina Xu

Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI 53706.

Weibo Cai

Department of Radiology and Medical Physics, University of Wisconsin-Madison, Madison, WI 53705 xudong.wang@wisc.edu gyao@uestc.edu.cn linyuan@uestc.edu.cn wcai@uwhealth.org.

Yuan Lin

School of Materials and Energy, State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan 610054, China; xudong.wang@wisc.edu gyao@uestc.edu.cn linyuan@uestc.edu.cn wcai@uwhealth.org.

School of Electronic Science and Engineering, the Center for Information in Medicine, University of Electronic Science and Technology of China, Chengdu, Sichuan 611731, China.

Xudong Wang

Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI 53706; xudong.wang@wisc.edu gyao@uestc.edu.cn linyuan@uestc.edu.cn wcai@uwhealth.org.

References

PubMed